PRODUCTS
Phase Change Material
Phase change material is designed to maximize heat sink performance and improve component reliability. Thermal Phase Change Material completely fills interfacial air gaps and voids.
Product Description
Phase change material is designed to maximize heat sink performance and improve component reliability. Thermal Phase Change Material completely fills interfacial air gaps and voids. It also displaces entrapped air between power dissipating electronic components.
At room temperature, TPCM400 material is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to a heat sink or component surface. Upon reaching its melting temperature of 52 ℃, TPCM400 begins to soften and flow, filling the microscopic irregularities of the component it comes into contact with. The result is an interface with minimal bond-line thickness and thermal contact resistance
TPCM400 can be supplied as sheets, rolls and custom die-cut configurations.
Product Features
▪ Low thermal resistance ( 0.015°C-in2/W @ 50 psi)
▪ High reliability
▪ Inherently tacky and no adhesive required
▪ RoHS compliant
Typical Applications
▪ CPUs (Notebooks, Desktops, Servers)
▪ Chipsets
▪ GPU
▪ ASICS Chips
Technical Specification
| Performance | PCM400 | PCM600 | Test Method |
| Structure | Non-reinforced film | Non-reinforced film | |
| Color | Grey | Grey | Visual |
| Phase Change Temp (℃) | 52 | 52 | ASTM D3418 |
| Thickness (mm) | 0.075-0.5 | 0.075-0.5 | ASTM D374 |
| Density (g/cc) | 2.93 | 3.1 | ASTM D792 |
| Flamming Rate | V-0 | V-0 | |
| Operation Temp (oC) | -40~150 | -40~150 | |
| Thermal | |||
| Thermal Conductivity (W/m-K) | 4.0 | 6.0 | ASTM D5470 |
|
Thermal Resistance (°C-in2/W)* @ 10 psi (69 KPa) @ 50 psi (345 KPa) |
0.03 0.015 |
0.026 0.013 |
ASTM D5470 |
| Electric | |||
| Volume Resistance (Ohm-cm) | 2*1012 | 2*1012 | ASTM D257 |
188-2226-7107
TIANJIN BROTHERS TECHNOLOGY CO., LTD.
Tel: 18822267107
Email:gavin.ma@brothers-tech.com